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Adhesive epoxy heat sink thermal bonding system two syringes

Product Code:HSCEPOXY20G

Stock Available: 0

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Adhesive epoxy heat sink thermal bonding system two syringes

Adhesive,epoxy,heat sink,thermal bonding system,20ml,two syringes

Electrolube 2 Part Thermal Bonding Epoxy


  • Two part, metal oxide loaded, thermal bonding system
    Can be used to bond heat sinks assemblies in "piggy back" arrangements, assembly of complex heat sink and as a bonding medium in surface mounting assemblies
    Excellent electrical insulation properties
    Solvent free system ensures that mated surfaces cannot come into contact, ensuring no electrical leakage through the bond
    Extremely thin curing coating of approx 200 microns
    Bonds a wide range of surfaces; dissimilar metals, epoxies, acrylics, polycarbonates etc.
    Room temperature curing. Mix ratio 3 to 1. Usable life when mixed: 3 to 4 hours
    Specific heat capacity: 0.5cal/g/?C @ 30?C resin, 0.35cal/g/?C @ 30?C hardener
    Cure time: 8 to 12 hrs @Room Temp; Hard 48 hrs @Room Temp; Full Cure 45 mins @100?C
    Tensile strength 2200N/cm? Resistivity 1014 � 1015 Ω cm

[   ] HSCEPOXY.pdf

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